By Assi Hansen, Isamu Miyamoto, Tiina Amberla, Yasuhiro Okamoto One of the most employed material combinations in microtechnology is the glass-silicon pair. Since the huge growth of the microelectromechanical devices, sensors and micro-fluidic devices, bonding of this couple has become more and more critical issue. Many of these glass-silicon bonding processes, for example anodic bonding, […]
