By Debbie Sniderman Contactless methods are next in the evolution of consumer payment options. Physical contact was needed to integrate payment cards with point-of-sale terminals using magnetic stripes or chips. The faster tap-and-go contactless interactions using Radio Frequency (RF) communication and inductive coupling with a card reader are becoming more widespread. They’re more convenient, more […]
Tag: Laser Ablation
Dicing of Thin Si Wafers with a Picosecond Laser Ablation Process
By Christian Fornaroli Currently, electrical semiconductor components such as LEDs, solar cells or transistors are commonly produced in a batch process. This way, many identical components can be processed in parallel on one big wafer; subsequently, each chip has to be singulated. Mechanical sawing with diamond blades has been used for a long time, but […]